High precision thickness measurements using tactile probes

Wafer thickness measuring station WDM-1: high precision measurement of wafer thickness (Wafer ⌀ from 100...300 mm) // measurement range thickness: 0...10 mm // measurement uncertainty (⌀ 300 mm range): < 50 nm // measurement uncertainty (center): < 20 nm

As usual, our SIOS experts have prepared both theoretical information and practical application examples for you.

Starting with a description of typical influences and contributions to measurement uncertainty we will, among other things, talk about:

comparisons between different device principles of tactile thickness measurement,
the interferometric tactile gauging-probe LM 20 and LM 50 from SIOS and their advantages over other high-precision gauges,
applications for high-precision thickness measurements such as the SIOS Gauge-block calibration system EPP (the lens and wafer thickness measuring station will be shown) as well as
possibilities of upgrading existing length and thickness measurement setups with interferometers.

At the end, our speakers will answer questions from the live webinar chat.

Speakers: Wolfram Meyer // Michael Kühnel, Project Manager R&D

Language: English

Recording date: March 08, 2022

Time: 50 min